Qualcomm Job Intern

Position: Software Engineering Intern

Location: Noida

Qualification: Bachelor's or Master's Degree in Electrical Engineering, Computer Science Engineering, Communication Engineering, Electronics & Communications Engineering(2024)

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Position: Hardware Engineering Intern

Location: Noida

Qualification: Bachelor's or Master's Degree in Electrical Engineering, Computer Science Engineering, Communication Engineering, Electronics & Communications Engineering(2025)

Required Skills: Must be available for 11 months internship from July'24-June'25. Verifying SoC with embedded RISC/DSP processors, communications/ networking ASICs. Verilog or VHDL, C/C++, Tcl/Perl/shell-scripting. RTL design experience and/or strong OO programming knowledge. Knowledge of VLSI, wireless/wired communications and protocols or graphics/video multi-media. Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout is required in RF/Analog/Mixed Signal IC Design

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Position: Interim Engineering Intern_SW

Location: Hyderabad / Bangalore / Chennai / Noida

Qualification: Masters, Bachelors: Computer Science Engineering, Communication Engineering, ECE

Required Skills: Multimedia Technologies such as Audio and Video codecs, Image Processing. Wireless Modem Technologies, such as 4G, WiFi, Bluetooth, Self-Organizing Networks. Platform Level SW, such as, Linux, Android, Windows, Board Support Packages. IOT Technologies, for Connected Cameras, Smart Assistants, Drones, Virtual Reality, Augmented Reality.

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Position: Interim Engineering Intern_SW

Location: Hyderabad

Qualification: Masters, Bachelors: Computer Science Engineering, Communication Engineering, ECE

Required Skills: Development of real-time embedded software and device drivers. Mobile SW development for Windows Mobile, Android or Linux. Good understanding of OS concepts, Data structures, etc. C/C++ and object oriented design. Wireless network standards such as CDMA/GSM/UMTS/LTE. Linux/UNIX, Linux Drivers, Linux Kernel Development • Protocols such TCP/UDP/IP/SIP/RTP etc. Multimedia technologies including Audio, Video, Imaging. Excellent analytical and problem solving skills.Ability to collaborate and work in teams. Good verbal and written communication skill . SW development for Android, Window Mobile based Embedded Platform. Multimedia software stack, firmware and driver Development.Wireless Modem and connectivity Software and Firmware Development. Communication protocol stack Software Development. Kernel, BSP and Device Driver Development. Design and development based on Object oriented programming.

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Position: Interim Engineering Intern- HW

Location: Bangalore

Qualification: Masters, Bachelors: Electrical Engineering , VLSI , Embedded and VLSI , ECE

Required Skills: Verifying SoC with embedded RISC/DSP processors, communications/ networking ASICs. Verilog or VHDL, C/C++, Tcl/Perl/shell-scripting. RTL design experience and/or strong OO programming knowledge. Knowledge of wireless/wired communications and protocols or graphics/video multi-media is a plus. Knowledge in PLL, LNA, OpAmp, CMOS, ADC/DAC, Cadence, SpectreRF, or Layout is required in RF/Analog/Mixed Signal IC Design. Excellent analytical and problem solving skills.Ability to collaborate and work in teams. Good verbal and written communication skill

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